EAMPLES OF PROJECTS

• Cryogenic Electronics: Part 2," Cold Facts) (technical magazine of the Cryogenic Society of America), vol. 37, no 2, pp. 16-18. April 1, 2021
  http://cryogenicsociety.org/38017/news/cryogenic_electronics_part_2/
  
  
• Cryogenic Electronics: Part 1," Cold Facts (technical magazine of the Cryogenic Society of America), vol. 7, no 1, pp. 14-17. February 1, 2021
  http://cryogenicsociety.org/37931/news/cryogenic_electronics_part_1/
  
  
• "Encapsulants for High-Temperature Power Electronics," WNEVC 2020 (World New Energy Vehicle Congress 2020), 27 September 2020. Request a copy.
  
  
• R. K. Kirschman, "Packaging & Assembly for High-Temperature Electronics, Part V - Reliability & testing," MEPTEC Report, vol. 23, no. 4, pp. 20-23, Winter 2019.
  http://www.meptec.org/Downloads/MTRpt-23.4.pdf
  
  
• R. K. Kirschman, "Packaging & Assembly for High-Temperature Electronics, Part IV - Materials behavior - Mechanical," MEPTEC Report, vol. 23, no 3, pp. 19-22, Fall 2019.
  http://issuu.com/mepcom/docs/meptec_report_fall_2019?e=2362861/66731956
  
  
• R. K. Kirschman, "Packaging & Assembly for High-Temperature Electronics, Part III - Materials behavior - Electrical," MEPTEC Report, vol. 23, no. 2, pp. 20-22, Summer 2019.
  http://www.meptec.org/Downloads/MTRpt-23.2.pdf
  
  
• R. K. Kirschman, "Packaging & Assembly for High-Temperature Electronics, Part II - Materials Behavior - Thermomechanical & Thermal," MEPTEC Report, vol. 23, no 1, pp. 22-24, Spring 2019. http://issuu.com/mepcom/docs/meptec_report_spring_2019?e=2362861/66731956
  
  
• R. K. Kirschman, "Packaging & Assembly for High-Temperature Electronics, Part I - Devices and Materials," MEPTEC Report, vol. 22, no. 4, pp. 19-22, Winter 2018.
  http://issuu.com/mepcom/docs/meptec_report_winter_2018?e=2362861/66731956
  
  
• F. R. Ihmig, S. G. Shirley, R. K. Kirschman and H. Zimmermann, "Frozen cells and bits - Cryoelectronics advances biopreservation," IEEE Pulse, v. 4, no. 5, pp. 35-43, Sept./Oct. 2013; DOI: 10.1109/MPUL.2013.2271685. http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6603376
  
  
• R. R. Ward, W. J. Dawson, L. Zhu, R. K. Kirschman, G. Niu, R. M. Nelms, O. Mueller, M. J. Hennessy, E. K. Mueller R. L. Patterson, J. E. Dickman, and A. Hammoud, "SiGe semiconductor devices for cryogenic power electronics - IV," Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition (APEC '06), Dallas, Texas, 19-23 March 2006, ISBN: 0-7803-9547-6. http://2005.cec-icmc.org/techindiv.asp?paperNumber=M1-K-03
  
  
• Rufus R. Ward, Randall K. Kirschman, Murzy D. Jhabvala, R. Sachidananda Babu, David V. Camin, Valerio Grassi, "Development of Ge JFETs for Deep-Cryogenic Preamplifiers," Proc. SPIE Vol. 4850, IR Space Telescopes and Instruments, Ed. John C. Mather, March 2003, pp. 910-918. http://spie.org/x648.xml?product_id=461756
  
  
• R. K. Kirschman, W. M. Sokolowski, and E. A. Kolawa, "Die Attachment for −120°C to +20°C Thermal Cycling of Microelectronics for Future Mars Rovers – An Overview," J. Electronic Packaging, vol. 123, pp. 105-111, June 2001
  http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JEPAE4000123000002000105000001&idtype=cvips&gifs=Yes
  
  
  

Home

Last updated on 23 November 2021.